Conference Proceedings

Third International Conference on Advances in Mechanical, Aeronautical and Production Techniques - MAPT 2015

A Proposed Mechanism for the Thickening Behavior of SiC– Polyethylene Glycol Abrasive Slurry during Silicon Ingot Slicing into Wafers for Photovoltaic Applications

Author(s) : RONALD ALLAN S. DE LOS REYES

Abstract

The present study presents a mechanism to account for the transformation of silicon carbide – polyethylene glycol abrasive slurries into thick slurries. Based on comparative observations and the results of other workers, it is proposed that the thickening behavior is the result of siloxane bonds forming bridges that connect the kerf or silicon particles which eventually increases the density of the slurry. It is further suggested that the source for this reaction would be the polyethylene glycol itself due to its possible degradation into smaller compounds after repeated use in the cutting operation.

Conference Title : Third International Conference on Advances in Mechanical, Aeronautical and Production Techniques - MAPT 2015
Conference Date(s) : 11-12 APRIL 2015
Place : G Tower Hotel, Kuala Lumpur, Malaysia
No fo Author(s) : 1
DOI : 10.15224/978-1-63248-059-0-62
Page(s) : 5 - 8
Electronic ISBN : 978-1-63248-059-0
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