Conference Proceedings

International Conference on Advances in Computer Science and Electronics Engineering - CSEE 2014

Multilevel System for Thermal Design, Control and Management of Electronic Components

Author(s) : I. A. KHARITONOV   , K. O. PETROSYANTS   , N.I. RYABOV   , P.A. KOZYNKO   

Abstract

The methodology and software tools for multi-level thermal and electro-thermal design of electronic components are presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs and VLSIs; 3) Hybrid ICs, MCMs and PCBs. The actual test validation using IR thermal measurement is demonstrated for all types of components.

Conference Title : International Conference on Advances in Computer Science and Electronics Engineering - CSEE 2014
Conference Date(s) : 08-09 March, 2014
Place : Hotel G Tower, Kuala Lumpur, Malaysia
No fo Author(s) : 4
DOI : 10.15224/978-1-63248-000-2-60
Page(s) : 150 - 155
Electronic ISBN : 978-1-63248-000-2
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