International Conference on Advances in Computer Science and Electronics Engineering - CSEE 2014
Author(s) : I. A. KHARITONOV , K. O. PETROSYANTS , N.I. RYABOV , P.A. KOZYNKO
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components are presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs and VLSIs; 3) Hybrid ICs, MCMs and PCBs. The actual test validation using IR thermal measurement is demonstrated for all types of components.